June 18 (Reuters) - Takano Co Ltd 7885.T :
* Says it enters into an agreement with Topcon Corp and its
unit,
to acquire manufacturing and sale business of semiconductor
wafer surface inspection device and proximity exposure device on
July 31
* Transaction amount remains undisclosed
Source text in Japanese: https://goo.gl/NK1jvR
Further company coverage: 7885.T
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