Brief: Tokyo Board Industries announces bonds and loan for new factory
14/11/2016 06:56
Nov 14 (Reuters) - Tokyo Board Industries Co Ltd 7815.T :
* Says it issues the fourth series 10-yr unsecured
corporation bonds worth totaling 2.5 billion yen on Sept. 20
with coupon rate of 0.18 percent
* Says it takes out a loan of 3 billion yen from bank on
Sept. 20 with interest rate of 1 percent and repayment date on
Sept. 10, 2026
* Proceeds will be used for establishment of new factory in
Chiba prefecture and for purchase of relevant equipments
Source text in Japanese: https://goo.gl/5aghHr
Further company coverage: 7815.T
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