Brief: Nikkei Says Japan's Toppan To Build Singapore Chip Package Substrate Plant
13/03/2024 17:11
March 13 (Reuters) -
* JAPAN'S TOPPAN TO BUILD SINGAPORE CHIP PACKAGE SUBSTRATE
PLANT -
NIKKEI
* TOPPAN TO BEGIN OPERATIONS AT END OF 2026 AT SINGAPORE
CHIP
PACKAGE SUBSTRATE PLANT - NIKKEI
* TOPPAN'S INVESTMENT IN SINGAPORE PLANT ESTIMATED AT 50
BILLION
YEN - NIKKEI
Further company coverage: 7911.T
((Reuters.Briefs@thomsonreuters.com;))
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