Brief: Toppan Holdings: IBM And Toppan Photomask Plan To Develop Photomask Capability Related To 2-nm Logic Semiconductor Node Using EUV Lithography For Five Years Starting 1Q 2024
07/02/2024 01:09
Feb 7 (Reuters) - TOPPAN Holdings Inc 7911.T :
* TOPPAN PHOTOMASK SIGNS AGREEMENT WITH IBM FOR JOINT
RESEARCH AND
DEVELOPMENT ON SEMICONDUCTOR EUV PHOTOMASKS
* TOPPAN HOLDINGS - IBM AND TOPPAN PHOTOMASK PLAN TO DEVELOP
PHOTOMASK CAPABILITY RELATED TO 2-NM LOGIC SEMICONDUCTOR NODE
USING EUV LITHOGRAPHY FOR FIVE YEARS STARTING 1Q 2024
Source text: https://www.prnewswire.com/news-releases/toppan-photomask-signs-agreement-with-ibm-for-joint-rd-on-semiconductor-euv-photomasks-302055261.html
Further company coverage: 7911.T
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