Brief: Toppan: To Build New Flip Chip Ball Grid Array (FC-BGA) Substrate Plant In Singapore, Aims To Start Production In End-2026
14/03/2024 03:08
March 14 (Reuters) - TOPPAN Holdings Inc 7911.T :
* TOPPAN - TO BUILD NEW FLIP CHIP BALL GRID ARRAY (FC-BGA)
SUBSTRATE PLANT IN SINGAPORE, AIMS TO START PRODUCTION IN
END-2026
Source text: https://www.holdings.toppan.com/ja/news/2024/03/newsrelease240314_1.html
Further company coverage: 7911.T
(Reporting by Kantaro Komiya)
((Kantaro.Komiya@thomsonreuters.com;))
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