REG - Transense Technlgy - Strategic US Packaging Collaboration

Transense TechnologiesAnnouncement

Tue 07:00

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RNS Number : 2997J  Transense Technologies PLC  20 May 2025

The information contained within this announcement is deemed by the Company to
constitute inside information pursuant to Article 7 of EU Regulation 596/2014
as it forms part of UK domestic law by virtue of the European Union
(Withdrawal) Act 2018 as amended.

 

20 May 2025

Transense Technologies plc

("Transense" or the "Company")

 

Strategic US packaging collaboration with ISI

 

Transense Technologies plc, the UK-based developer of Surface Acoustic Wave
(SAW) torque and temperature sensing systems, has signed a new licensing and
supply agreement with ISI Interconnect Systems, a Molex company, to support
the packaging and distribution of its proprietary SAW Application Specific
Integrated Circuit (ASIC) technology in the United States.

 

The agreement follows more than 12 months of technical and commercial
development with ISI and marks a significant milestone in Transense's
expansion within the US defence and aerospace sectors. Under the terms of the
agreement, ISI will carry out final device packaging at its advanced
semiconductor facility in Camarillo, California. The packaged ASICs will then
be supplied by ISI to end customers within the US, creating a domestic supply
chain for Transense's specialist technology.

 

Developed by Transense, the ASIC is a key component in SAW torque and
temperature sensor systems and is typically built into electronic control
units (ECUs) where precise and high-reliability signal processing is critical.
The packaging process transforms bare die chiplets into high-integrity, rugged
surface mount electronics components, suitable for a variety of demanding
applications such as in aerospace engine output torque sensing.

 

Ryan Maughan, Managing Director at Transense, said: "This collaboration has
been under development for over 12 months, and we are delighted to have it
signed.  Establishing an ASIC packaging solution within the US offers
significant benefits to our customers there in terms of responsiveness,
logistics, and overall supply chain security."

 

"With ISI's technical capabilities and experience in high-reliability
semiconductor packaging, we're confident in the quality and reliability of the
finished components. It's an important step forward as we scale up activity in
the US market."

 

"This end-to-end production flow within the USA, from wafer manufacturing, to
dicing and final packaging, positions Transense to be able to respond more
flexibly to demand from US customers and enhances the resilience of its supply
chain at a critical time for global electronics production."

 

Tom Casey, Vice President of ISI, commented: "We're excited to be working with
Transense on this highly specialised packaging process. Our Camarillo facility
is well equipped for this kind of precision work, and we're pleased to support
the delivery of such innovative technology to key sectors in the United
States."

 

The agreement strengthens Transense's US supply chain for ASIC production and
defence/aerospace applications. It is expected to generate a substantial new
revenue stream for the business based on forecast end customer demand.

 

For further information please visit www.transense.com or contact:

 Transense Technologies plc                                        Via Investor Relations

 Nigel Rogers (Executive Chairman)                                 (see below)

 Ryan Maughan (Managing Director)

 Melvyn Segal (Chief Financial Officer)
 Cavendish Capital Markets Limited (Nominated Adviser and Broker)  0207 220 0500

 Adrian Hadden / Callum Davidson (Corporate Finance)

 Jasper Berry (Sales)
 Investor Relations                                                Tel: +44 (0)1869 238380

 Anice McNamee                                                     Investor.relations@transense.co.uk

 

Notes to Editors:

 

About Transense Technologies:

Transense Technologies is a UK-based innovator in sensor systems.  It
operates through two business units:

 

Translogik offers advanced solutions for tyre management and vehicle condition
monitoring, providing cutting-edge tools and software to enhance safety,
compliance and operational efficiency in the automotive and fleet sectors.

 

SAWsense is a developer of Surface Acoustic Wave torque and temperature
sensing systems.

 

Find out more at: https://www.transense.com/ (https://www.transense.com/) .

 

About SAWsense and the significance of this agreement:

SAWsense designs and develops specialist sensor systems for integration into
OEM products based on proprietary Surface Acoustic Wave ("SAW") technology.
Its technology is increasingly used by leading global players in aerospace,
automotive E-drive, robotics and motorsport applications.   Customers in
these demanding markets require robust supply chain solutions across multiple
locations.

 

This agreement secures the final stage of production for the current
generation of Transense ASIC with a world class, aerospace accredited,
microelectronics manufacturer. This provides a secure supply chain to fulfill
projected demand from customers as they begin to ramp up production of engines
that use Transense sensing technology.

 

About ISI Interconnect Systems and Molex:

Find out more at https://www.isipkg.com (https://www.isipkg.com) and
httpenginess://www.molex.com (https://www.molex.com)

 

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