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RNS Number : 3440B Transense Technologies PLC 22 April 2026
RNS Reach - non-regulatory announcement
Transense Technologies plc
("Transense" or the "Company")
Transense accelerates SAWsense scale-up with precision equipment investment
Transense Technologies plc, a leading innovator in sensor technology and
measurement systems, has taken delivery of a bespoke, high-precision die
bonding machine to support the commercial scale-up of its SAWsense division.
The £0.4m investment in this new machine marks a key step towards developing
high-volume production processes for customers requiring highly repeatable
sensor installations at scale and takes the capital investment for the pilot
SAW sensor installation line to more than £1m. This investment programme has
been funded by internally generated cash flow, augmented by an asset backed
financing facility to provide additional headroom.
Transense's patented Surface Acoustic Wave (SAW) technology is used to measure
torque, force and temperature in safety and performance-critical applications,
particularly in demanding environments such as robotics, aerospace,
automotive, electric drive systems, and motorsport. The new equipment enables
micron-level precision placement of SAW sensing elements onto shafts and other
components, delivering consistent, repeatable installations suitable for
high-volume production.
SAWsense designs, supplies and licenses advanced SAW-based sensor solutions to
leading aerospace, automotive and industrial customers, including GE
Aerospace, Motion Applied and Airbus, alongside other confidential OEM and
Tier 1 customers.
The purchase follows an 18-month development programme, including trials at
Newcastle University's Driving the Electric Revolution Industrialisation
Centre (DER-IC) to define a production-ready process.
The automated die bonder, based on commercially available equipment commonly
used in semiconductor packaging, provides the accuracy and flexibility
required for prototyping and high-mix production, and demonstrates process
capability for future high-volume manufacturing from hundreds of thousands to
millions of units per year.
Ryan Maughan, Managing Director at Transense Technologies plc, commented:
"This investment marks an important milestone for SAWsense as we transition
from development into scalable manufacturing capability.
"As demand for our wireless, passive sensing technology continues to grow
globally, we aim to accelerate the adoption of SAWsense technology across
multiple high-value sectors and support our customers' successful adoption of
the technology into their products.
"The new precision die bonding platform enables highly repeatable placement of
our SAW sensor elements and provides the foundation for high-volume production
process development to meet growing demand from robotics, aerospace and
automotive customers. This is not just new equipment, it's a crucial step
toward scalable revenue, reduced adoption barriers, and the possibility of
meaningful volume contracts across multiple high-value sectors."
For further information please visit www.transense.com or contact:
Transense Technologies plc Via Investor Relations
Nigel Rogers (Executive Chairman) (see below)
Ryan Maughan (Managing Director)
Melvyn Segal (Chief Financial Officer)
ENDS
Media contact: Amy Maughan MCIPR. E: amy@amymaughanpr.co.uk
(mailto:amy@amymaughanpr.co.uk) / Tel: 07980 703566.
Investor Relations: Anice McNamee E: investor.relations@transense.co.uk
(mailto:investor.relations@transense.co.uk) / Tel: +44 (0)1869 238380 /
Website: www.transense.com (http://www.transense.com/) .
Notes to editors: Transense Technologies plc is a UK-based developer of
advanced sensor systems for industrial and automotive applications. Through
its SAWsense and Translogik business divisions, the company delivers
innovative technology for measuring torque, temperature and tyre performance
in demanding environments. Transense is listed on the AIM market of the London
Stock Exchange (AIM: TRT). The company is headquartered in Oxfordshire.
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