Picture of Signetics logo

033170 Signetics Share Price

0.000.00%
kr flag iconLast trade - 00:00
TechnologySpeculativeMicro CapSucker Stock

Momentum

Relative Strength (%)
1m-4.04%
3m-16.38%
6m-22.97%
1yr-58.99%
Volume Change (%)
10d/3m-81.41%
Price vs... (%)
52w High-61.89%
50d MA-6.82%
200d MA-22.4%

Growth & Value

Shareholder Activity

TypeBuy / Hold / Sell
Institutions
Directors
Community

Guru Screens

Quality

NameIndustryMarket
Return on Capital-64.59%
Return on Equity-54.42%
Operating Margin-39.43%

Financial Summary

Year End 31st DecUnit202020212022202320242025E2026ECAGR / Avg
Total RevenueKR₩m201,544.56269,880.77287,600.05185,484.58118,150.99n/an/a-11.59%
Operating Profitm
Net Profitm
EPS Reported
Diluted Normalised EPS
EPS Growth%n/an/a-56.1n/an/an/an/an/a
PE Ratiox
PEG
Profitability
Operating Margin%
ROA%
ROCE%
ROE%
Cashflow
Op. Cashflow ps
Capex ps
Free Cashflow ps
Dividends
Dividend ps
Dividend Growth%
Dividend Yield%
Dividend Coverx
Balance Sheet
Cash etcm
Working Capitalm
NFAm
Net Debtm
Book Valuem
Diluted Weighted Average Sharesm
Book Value ps

Health Trend(F-Score)

12345678910

Bankruptcy Score(Z-Score)

Distress
Cautious
Safe

Earnings Manipulation Risk(M-Score)

Other Ratios

Leverage (ttm)Total- Intang+ Pension
Gross Gearing
Net Gearing
Cash / Assets

Recent History

Latest interim period vs. prior periodIndustryMarket
Sales Growth
EPS Growth
3yr Compound Annual Growth RateIndustryMarket
Sales CAGR
EPS CAGR
DPS CAGR

Graphical History

Revenue
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Net Income
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Normalised EPS
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PE Ratio Range
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Dividend Yield Range
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Analyst Forecasts

Price target
( price)
31st Dec 202531st Dec 2026
Est. Long Term Growth Rate: Net Profit
()
EPS
()
DPS
()
Net Profit
()
EPS
()
DPS
()
Consensus Estimate
1m Change
3m Change

Analyst Consensus

Strong SellSellHoldBuyStrong Buy

EPS 2025 / 2026

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Profile Summary

Signetics Corp. is a Korea-based company principally engaged in the semiconductor packaging business. The Company provides laminate packages, tape packages, lead frame packages and flip chip packages for applications in the communication, consumer and computing markets. Its laminate packages include fine pitch ball grid array (FBGA), board on chip (BOC), stacked die chip scale package (CSP), plastic BGA (PBGA), heat spreader PBGA, enhanced PBGA and fine pitch land grid array (FLGA). Its tape packages include tape BGA and thin fine BGA. Its lead frame packages include metric, low-profile and thin quad flat package (QFP), thin-shrink small outline package (TSSOP), thin small-outline packages (TSOP) and quad flat no-lead (QFN). Its flip chip packages include flip chip BGA (FCBGA) and flip-chip chip scale package (FCCSP).

Directors

Last Annual
December 31st, 2024
Last Interim
December 31st, 2024
Incorporated
September 12th, 1966
Public Since
November 26th, 2010
No. of Shareholders
24,049
No. of Employees
169
Sector
Semiconductors & Semiconductor Equipment
Industry
Technology
Exchange
kr flag iconKorea Exchange - KOSDAQ
Shares in Issue
85,728,319

033170 Share Price Performance

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