Picture of ChipMOS TECHNOLOGIES logo

IMOS ChipMOS TECHNOLOGIES Share Price

0.000.00%
us flag iconLast trade - 00:00
TechnologyBalancedMid CapHigh Flyer

Momentum

Relative Strength (%)
1m+5.31%
3m+52.84%
6m+73.73%
1yr+55.29%
Volume Change (%)
10d/3m+44.94%
Price vs... (%)
52w High-26.66%
50d MA+1.28%
200d MA+47.81%

Growth & Value

Shareholder Activity

TypeBuy / Hold / Sell
Institutions
Directors
Community

Guru Screens

Quality

NameIndustryMarket
Return on Capital1.83%
Return on Equity0.94%
Operating Margin2.69%

Financial Summary

Year End 31st DecUnit202020212022202320242025E2026ECAGR / Avg
Total RevenueTWDm23,011.3827,400.0323,517.0621,356.2322,695.91n/an/a2.22%
Operating Profitm
Net Profitm
EPS Reported
Diluted Normalised EPS
EPS Growth%-9.53+114.42-34.03-42.61-27.91n/an/an/a
PE Ratiox
PEG
Profitability
Operating Margin%
ROA%
ROCE%
ROE%
Cashflow
Op. Cashflow ps
Capex ps
Free Cashflow ps
Dividends
Dividend ps
Dividend Growth%
Dividend Yield%
Dividend Coverx
Balance Sheet
Cash etcm
Working Capitalm
NFAm
Net Debtm
Book Valuem
Diluted Weighted Average Sharesm
Book Value ps

Health Trend(F-Score)

12345678910

Bankruptcy Score(Z-Score)

Distress
Cautious
Safe

Earnings Manipulation Risk(M-Score)

Other Ratios

Leverage (ttm)Total- Intang+ Pension
Gross Gearing
Net Gearing
Cash / Assets

Recent History

Latest interim period vs. prior periodIndustryMarket
Sales Growth
EPS Growth
3yr Compound Annual Growth RateIndustryMarket
Sales CAGR
EPS CAGR
DPS CAGR

Graphical History

Revenue
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Net Income
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Normalised EPS
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PE Ratio Range
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Dividend Yield Range
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Analyst Forecasts

Price target
( price)
31st Dec 202531st Dec 2026
Est. Long Term Growth Rate: Net Profit
()
EPS
()
DPS
()
Net Profit
()
EPS
()
DPS
()
Consensus Estimate
1m Change
3m Change

Analyst Consensus

Strong SellSellHoldBuyStrong Buy

EPS 2025 / 2026

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Profile Summary

ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.

Directors

Last Annual
December 31st, 2024
Last Interim
September 30th, 2025
Incorporated
July 28th, 1997
Public Since
April 19th, 2013
No. of Shareholders
82,046
No. of Employees
5,890
Sector
Semiconductors & Semiconductor Equipment
Industry
Technology
Exchange
us flag iconNASDAQ Global Select Market
Shares in Issue
687,253,126
Blurred out image of a map
Address
No.1, BAOSHAN, 300
Web
https://www.chipmos.com/
Phone
+886 35770055
Contact
Jesse Huang
Auditors
PricewaterhouseCoopers

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